9. PACKAGE/PAD LOCATIONS
9.1. PAD Assignment
Preliminary
SPC11A
Chip Size: 1370µm x 1280µm
This IC substrate should be connected to VSS
Note1: Chip size included scribe line.
Note2: The 0.1µF capacitor between VDD and VSS should be placed to IC as close as possible.
9.2. Ordering Information
Product Number
SPC11A-nnnnV-C
Note1: Code number (nnnnV) is assigned for customer.
Note2: Code number (nnnn = 0000 - 9999); version (A = A - Z).
Package Type
Chip form
© Sunplus Technology Co., Ltd.
11
Proprietary & Confidential
JUL. 09, 2001
Preliminary Version: 0.1