MF-SM150/33(2008) Ver la hoja de datos (PDF) - Bourns, Inc
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MF-SM150/33 Datasheet PDF : 4 Pages
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MF-SM Series - PTC Resettable Fuses
Typical Time to Trip at 23 °C
100
10
Typical Part Marking
Represents total content. Layout may vary.
MANUFACTURER'S
TRADEMARK
030
0A
PART IDENTIFICATION
DATE CODE -
WEEK 1 OF 2000 = 0A
(YEAR & WEEK)
WEEK 27 OF 2000 = A0
(WEEK & YEAR)
1
0.1
0.01
0.001
0.1
1
10
100
Fault Current (Amps)
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
250
• Devices are not designed to be wave soldered to the bottom side of the
board.
200
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
150
• Devices can be cleaned using standard industry methods and solvents.
Note:
100
• If reflow temperatures exceed the recommended profile, devices may not
50
meet the performance requirements.
Rework
0
• A device should not be reworked.
160–220
10–20
120
Time (seconds)
Storage Recommendations
The recommended long term storage conditions for Multifuse® Polymer PTC devices are 40 °C maximum and 70 % RH maximum. All devices should
remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage recommendations are
exceeded. Devices stored in this manner have an indefinite shelf life.
MF-SM SERIES, REV. O, 02/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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