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MAC7100 Datasheet PDF : 48 Pages
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Freescale Semiconductor, Inc.
Electrical Characteristics
6 Maximum leakage occurs at maximum operating temperature. Current decreases by approximately one-half for
each 8 to 12 °C, in the ambient temperature range of 50 to 125 °C.
7 Below disruptive current conditions, the channel being stressed has conversion values of 0x3FF for analog inputs
greater than VRH and 0x000 for values less than VRL. This assumes that VDDA AVRH and VRL VSSA due to the
presence of the sample amplifier. Other channels are not affected by non-disruptive conditions.
8 Coupling Ratio, K, is defined as the ratio of the output current, IOUT, measured on the pin under test to the injection
current, IINJ, when both adjacent pins are overstressed with the specified injection current. K = IOUT ÷ IINJ. The input
voltage error on the channel under test is calculated as Verr = IINJ x K x RS.
9 Total injection current is determined by the number of channels injecting (for example, 15), external injection voltage
(VINJ – VPOSCLAMP, or VINJ – VNEGCLAMP), and the external source impedance, Rs, wherein all input channels have
the same values. To determine the error voltage on the converted channel, only the two adjacent channels are
expected to contribute to the error voltage: Verrj = (VINJ – VCLAMP) × K × 2.
10 For a maximum sampling error of the input voltage 1LSB, then the external filter capacitor, Cf 1024 × CSAMP. The
value of CSAMP in the new design may be reduced, or increased slightly.
Table 30. ATD Performance Specifications 1
Num C
Rating
Symbol
Min
Typ
Max
Unit
T1 D 10-bit Resolution
LSB
5
mV
T2 D 10-bit Differential Nonlinearity 2
DNL
–1
1
Counts
T3 D 10-bit Integral Nonlinearity 2
INL
–2
2
Counts
T4 D 10-bit Absolute Error 2, 3
AE
–2.5
2.5
Counts
T5 D Max input Source Impedance 4
RS
100
k
1 All voltages referred to VSSA, VDDA = 5.0 V±10%, ATD clock = 2.1 Mhz., –40 to 125 °C.
2 Note: 1 LSB = 1 Count (At VREF = 5.12 V, one 8 bit count = 20 mV, one 10-bit count = 5 mV)
3 These values include quantization error which is inherently 1/2 count for any A/D converter.
4 This value is based on error attributed to the specified leakage value of TBD nA resulting in an error of less than 1/2
LSB (2.5 mV). If operating conditions are less than worst case or leakage-induced error is acceptable, larger values
of source resistance is allowable.
3.10.4 ATD Timing Specifications
Table 31. ATD Timing Specifications
Num C
Rating
Symbol Min
Typ
Max
Unit
U1 D ATD Module Clock Frequency
Fclk
U2 D ATD Conversion Clock Frequency
Fatdclk
0.5
U3 D ATD 10-bit Conversion Period*
Clock Cycles NCONV10*
14*
Conv. Time TCONV10
7
25.0
MHz
2.0
MHz
28*
Cycles*
14
µsec
U4 D Stop Recovery Time (VDDA = 5.0 V)
TSR
100
µsec
Table 32. ATD External Trigger Timing Specifications
Num C
Parameter
Symbol
Min
Max
Unit
V1 D ETRIG Minimum Period
TPERIOD
1 sample +
CYCLE
1 conv. +
1 ATD clock
V2 D ETRIG Minimum Pulse Width
V3 D ETRIG Level Recovery 1
tPW
2
tLR
1
SYS CLK
SYS CLK
V4 D Conversion Start Delay
tDLY
2
SYS CLK
1 Time prior to end of conversion that the ETRIG pin must be deactivated so that another conversion sequence does
not start.
28
MAC7100 Microcontroller Family Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com

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