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M27C1024-35B7TR Ver la hoja de datos (PDF) - STMicroelectronics

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M27C1024-35B7TR
ST-Microelectronics
STMicroelectronics ST-Microelectronics
M27C1024-35B7TR Datasheet PDF : 16 Pages
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M27C1024
Table 9. Read Mode AC Characteristics (1)
(TA = 0 to 70 °C, –40 to 85 °C; –40 to 105 °C or –40 to 125 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC)
M27C1024
Symbol Alt
Parameter
Test Condition
-70
-80/-90
-10/-12
-15/-20
Unit
Min Max Min Max Min Max
tAVQV tACC Address Valid to Output Valid
E = VIL, G = VIL
70
80
100 ns
tELQV tCE Chip Enable Low to Output Valid
G = VIL
70
80
100 ns
tGLQV tOE Output Enable Low to Output Valid
E = VIL
35
40
50 ns
tEHQZ (2) tDF Chip Enable High to Output Hi-Z
G = VIL
0 30 0 30 0 30 ns
tGHQZ (2) tDF Output Enable High to Output Hi-Z
E = VIL
0 30 0 30 0 30 ns
tAXQX
tOH
Address Transition to Output
Transition
E = VIL, G = VIL 0
0
0
ns
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
Figure 7. Read Mode AC Waveforms
A0-A15
E
G
Q0-Q15
VALID
tAVQV
tGLQV
tELQV
tAXQX
VALID
tEHQZ
tGHQZ
Hi-Z
AI00705B
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, ICC, has three seg-
ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
transient current peaks is dependent on the ca-
pacitive and inductive loading of the device at the
output. The associated transient voltage peaks
can be suppressed by complying with the two line
output control and by properly selected decoupling
capacitors. It is recommended that a 0.1µF ceram-
ic capacitor be used on every device between VCC
and VSS. This should be a high frequency capaci-
tor of low inherent inductance and should be
placed as close to the device as possible. In addi-
tion, a 4.7µF bulk electrolytic capacitor should be
used between VCC and VSS for every eight devic-
es. The bulk capacitor should be located near the
power supply connection point.The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.
6/16

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