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LM317LD Ver la hoja de datos (PDF) - ON Semiconductor

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LM317LD Datasheet PDF : 12 Pages
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LM317L
MAXIMUM RATINGS
Rating
Input−Output Voltage Differential
Power Dissipation
Case 29 (TO−92)
TA = 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Symbol
VI−VO
Value
40
PD
RqJA
RqJC
Internally Limited
160
83
Unit
Vdc
W
°C/W
°C/W
Case 751 (SOIC−8) (Note 1)
TA = 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
PD
RqJA
RqJC
Internally Limited
180
45
W
°C/W
°C/W
Operating Junction Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. SOIC−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 23 for Thermal Resistance
variation versus pad size.
2. This device series contains ESD protection and exceeds the following tests:
Human Body Model, 2000 V per MIL STD 883, Method 3015.
Machine Model Method, 200 V.
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