IX2127 Ver la hoja de datos (PDF) - Clare Inc => IXYS
Número de pieza
componentes Descripción
Fabricante
IX2127 Datasheet PDF : 11 Pages
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IX2127
3 Manufacturing Information
3.1 Mechanical Dimensions
3.1.1 8-Pin DIP Through-Hole Package
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
0.254 TYP
(0.01)
PCB Hole Pattern
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
0.889 ± 0.102
(0.035 ± 0.004)
3.1.2 8-Pin SOIC Package
0.1905 / 0.2489
(0.0075 / 0.0098)
5.8014 / 6.1976
(0.2284 / 0.2440)
3.810 / 3.988
(0.150 / 0.157)
0.406 / 1.270
(0.016 / 0.050)
0.356 / 0.457
(0.014 / 0.018)
4.801 / 4.978
(0.189 / 0.196)
0.533 REF
(0.021 REF)
1.27 TYP
(0.05 TYP)
1.372 / 1.575
(0.054 / 0.062)
0.1016 / 0.2489
(0.0040 / 0.0098)
1.524 / 1.727
(0.060 / 0.068)
Dimensions
mm
(inches)
PCB Land Pattern
1.50
(0.059)
0.60
(0.024)
5.30
(0.209)
1.27
(0.050)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
10
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