7WB383 Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

7WB383

Bus Exchange Switch

ON Semiconductor 

7WB383

PACKAGE DIMENSIONS

ULLGA8 1.45x1.0, 0.35P

CASE 613AA−01

ISSUE A

D

A

B

ÉÉÉ PIN ONE

REFERENCE

ÉÉÉÉÉÉ 0.10 C

E

TOP VIEW

0.10 C

0.05 C

8X

0.05 C

SIDE VIEW

A1

A

SEATING

PLANE

C

e/2

1

L1

e

4

7X L NOTE 4

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

4. A MAXIMUM OF 0.05 PULL BACK OF THE

PLATED TERMINAL FROM THE EDGE OF THE

PACKAGE IS ALLOWED.

MILLIMETERS

DIM MIN MAX

A −−− 0.40

A1 0.00 0.05

b 0.15 0.25

D 1.45 BSC

E 1.00 BSC

e 0.35 BSC

L 0.25 0.35

L1 0.30 0.40

MOUNTING FOOTPRINT

SOLDERMASK DEFINED*

7X

0.48

8X

0.22

1.18

8

5

BOTTOM VIEW

8X b

0.10 C A B

0.05 C NOTE 3

0.53

1

PKG

OUTLINE

0.35

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

9

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