AD9364 Ver la hoja de datos (PDF) - Analog Devices

Número de pieza

componentes Descripción

Fabricante

AD9364

RF Agile Transceiver

Analog Devices 

AD9364

ABSOLUTE MAXIMUM RATINGS

Table 11.

Parameter

VDDx to VSSx

VDD_INTERFACE to VSSx

VDD_GPO to VSSx

Logic Inputs and Outputs to

VSSx

Input Current to Any Pin

Except Supplies

RF Inputs (Peak Power)

Tx Monitor Input Power (Peak

Power)

Package Power Dissipation

Maximum Junction

Temperature (TJMAX)

Operating Temperature Range

Storage Temperature Range

Rating

−0.3 V to +1.4 V

−0.3 V to +3.0 V

−0.3 V to +3.9 V

−0.3 V to VDD_INTERFACE + 0.3 V

±10 mA

2.5 dBm

9 dBm

(TJMAX − TA)/θJA

110°C

−40°C to +85°C

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Data Sheet

REFLOW PROFILE

The AD9364 reflow profile is in accordance with the JEDEC

JESD20 criteria for Pb-free devices. The maximum reflow

temperature is 260°C.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 12. Thermal Resistance

Package

Type

144-Ball

CSP_BGA

Airflow

Velocity

(m/sec)

0

1.0

θ 1, 2

JA

32.3

29.6

θ 1, 3

JC

9.6

θ 1, 4

JB

20.2

 1, 2

JT

0.27

0.43

2.5

27.8

0.57

1 Per JEDEC JESD51-7, plus JEDEC JESD51-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-STD 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Unit

°C/W

°C/W

°C/W

ESD CAUTION

Rev. C | Page 10 of 32

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