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LI0201

Ferrite Chip Beads

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Innovative Technology

for a Connected World

LI0201

Ferrite Chip Beads

Application Notes

LEAD-FREE/ROHS COMPLIANCE

All Laird Technologies’ surface mount and through hole EMI components (including assemblies with wire and cofired monolithic ferrite

chip beads and common mode chokes) are available lead-free and RoHS compliant.

PART NUMBERING SYSTEM

Lead-free board level part numbers are differentiated by a suffix descriptor. The suffix (-10) identifies the part number for all lead-free

parts. This part number suffix is for use on board level part numbers only.

PART NUMBER EXAMPLES

Old Part HZ0805E601R-00

New Part HZ0805E601R-10

contains lead

is lead-free

Old Part 28F0121-0SR contains lead

New Part 28F0121-0SR-10 is lead-free

All Laird Technologies’ new and old ferrite cable cores are RoHS compliant. No part number change for cable cores.

COMPOSITION

Laird Technologies’ lead-free component terminations and wire platings are 100% matte Tin (Sn) over a Nickel (Ni) barrier and are

reverse compatible with existing Tin (Sn)/Lead (Pb) materials.

Concerns over the use of pure tin coatings on component leads and terminations, due to the possibility of tin whiskering, are still under

industry discussion. Electroplating 100% matte tin over a nickel barrier is recognized as an effective whisker growth mitigation strategy

that is accepted by most industry groups. Laird Technologies’ maintains a minimum plating thickness of 2.5µm [99µin] of Tin, and

0.7µm [28µin] of Nickel.

RECOMMENDED LEAD-FREE

SOLDERING PROFILE

While Laird Technologies’ lead-free surface mount and

through hole components are reverse compatible with

existing Sn/Pb materials, higher peak temperatures (up to

260°C) provide better wetting characteristics during the

solder reflow process. The higher reflow temperatures

typically used for lead-free processes will not damage

Laird Technologies’ surface mount components, but

the delta T between the board and larger components

must be considered. Smaller delta Ts can be achieved

with slower belt speed to increase the pre-heat time.

Soldering cycle time (throughput) must be balanced with

reflow temperature. Allowance must be made for the

coldest part (largest heat sink) to solder, considering the

thermal mass of the board and size of the components.

global solutions: local support TM

USA: +1 800 634.2673

+1 423 308.1690

Europe: +49 8031.2460.0

Asia: +86 755.2714.1166

www.lairdtech.com

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