White Electronic Designs
WED3DG644V-D1
ORDERING INFORMATION FOR D1
Part Number
Clock Speed
CAS Latency
Height*
WED3DG644V10D1x-xx
100MHz
CL=2
27.94 (1.100”)
WED3DG644V7D1x-xx
133MHz
CL=2
27.94 (1.100”)
WED3DG644V75D1x-xx
133MHz
CL=3
27.94 (1.100”)
NOTES:
• Consult Factory for availability of RoHS products. (G = RoHS Compliant)
• Vendor specific part numbers are used to provide memory components source control. The place holder for this is shown as lower case “-x” in the part numbers above and is
to be replaced with the respective vendors code. Consult factory for qualified sourcing options. (M = Micron, S = Samsung & consult factory for others)
• Consult factory for availability of industrial temperature (-40°C to 85°C) option
PACKAGE DIMENSIONS FOR D1
3.99
(0.157)
67.74 (2.667) MAX
2.01 (0.079) MIN
23.19
(0.913)
28.24
(1.112)
32.79 (1.291)
4.60 (0.181)
1.50 (0.059)
3.81
(0.150)
TYP
27.94
(1.100)
19.99 MAX
(0.787)
3.99
(0.157)
MIN
3.20
(0.126)
MIN
0.99 ± 0.10
(0.039 ± 0.004)
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES).
June 2006
Rev. 3
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com