WED3C755E8M300BI Ver la hoja de datos (PDF) - White Electronic Designs Corporation

Número de pieza

componentes Descripción

Fabricante

WED3C755E8M300BI

RISC MICROPROCESSOR MULTI-CHIP PACKAGE

White Electronic Designs Corporation 

White Electronic Designs WED3C755E8M-XBX

FIG. 5 - PIN ASSIGNMENTS

Ball assignments of the 255 CBGA package as viewed from the top surface.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

Side profile of the CBGA package to indicate the direction of the top surface view.

Substrate Assembly

View

Underfill Encapsulant

Die

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

May, 2003

Rev 2

4

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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