UPC4061G2 Ver la hoja de datos (PDF) - NEC => Renesas Technology
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UPC4061G2 Datasheet PDF : 12 Pages
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µPC4061
5 RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL"(C10535E).
Type of Surface Mount Device
µPC4061G2: 8-pin plastic SOP (5.72 mm (225))
Process
Infrared Ray Reflow
Vapor Phase Soldering
Wave Soldering
Partial Heating Method
Conditions
Peak temperature: 230 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time.
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time.
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each side of the device).
Symbol
IR30-00-1
VP15-00-1
WS60-00-1
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µPC4061C: 8-pin plastic DIP (7.62 mm (300))
Process
Wave Soldering
(only to leads)
Partial Heating Method
Conditions
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
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Data Sheet G15038EJ3V0DS00
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