PF28F1602C3TD70 Ver la hoja de datos (PDF) - Intel

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PF28F1602C3TD70

Intel® Advanced+ Boot Block Flash Memory (C3)

Intel 

C3 SCSP Flash Memory

1.3

72-

Figure 1.

Package Ballout

66-Ball SCSP Package Ballout

1

A

NC

B

C

D

E

F

G

H

NC

234567

8 9 10 11 12

A20 A11 A15 A14 A13 A12 F-VSS F-VCCQ

NC

A16 A8 A10 A9 DQ15 S-WE# DQ14 DQ7

F-WE# NC A21

DQ13 DQ6 DQ4 DQ5

S-VSS F-RP# A22

DQ12 S-CS2 S-VCC F-VCC

F-WP# F-V

PP

A19

DQ11

DQ10 DQ2 DQ3

S-LB# S-UB# S-OE#

DQ9 DQ8 DQ0 DQ1

A18 A17 A7 A6 A3 A2

A1 S-CS1#

NC A5 A4 A0 F-CE# F-VSS F-OE# NC

NC

Top View, Balls Down

Notes:

1.

Flash memory upgrade balls are shown up to A21 (64-Mbit flash) and A22 (128-Mbit flash). In all flash

memory and SRAM combinations, 66 balls are populated on lower density devices. (Upper address

balls are not populated). Ball location A10 is NC on 16/2 devices only.

2.

To maintain compatibility with all JEDEC Variation B options for the C6 ball location, connect this C6

land pad directly to the land pad for the G4 (A17) ball.

26 Aug 2005

8

Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family

Order Number: 252636, Revision: 004

Datasheet

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