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PF28F1602C3TD70

Intel® Advanced+ Boot Block Flash Memory (C3)

Intel 

C3 SCSP Flash Memory

1.0

Introduction

This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory

(C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the

following combinations:

• 32-Mbit flash + 8-Mbit SRAM

• 32-Mbit flash + 4-Mbit SRAM

• 16-Mbit flash + 4-Mbit SRAM

• 16-Mbit flash memory + 2-Mbit SRAM

1.1

Document Conventions

Throughout this document, the following conventions have been adopted.

• Voltages:

— 2.7 V refers to the full voltage range, 2.7 V–3.3V

— 12 V refers to 11.4 V to 12.6 V

• Main block(s): 32-Kword block

• Parameter block(s): 4-Kword block

1.2

Table 1.

Product Overview

The C3 SCSP device combines flash memory and SRAM into a single package, which provides

secure low-voltage memory solutions for portable applications.

The flash memory provides the following features:

• Enhanced security.

• Instant locking/unlocking of any flash block with zero-latency

• A 128-bit protection register that enables unique device identification, to meet the needs of

next generation portable applications.

• Improved 12 V production programming for increased factory throughput.

Block Organization (x16)

Memory Device

32-Mbit Flash

16-Mbit Flash

2-Mbit SRAM

4-Mbit SRAM

8-Mbit SRAM

Note: All words are 16 bits each.

Kwords

2048

1024

128

256

512

26 Aug 2005

6

Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family

Order Number: 252636, Revision: 004

Datasheet

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