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PF28F1602C3TD70

Intel® Advanced+ Boot Block Flash Memory (C3)

Intel 

Intel® Advanced+ Boot Block Flash

Memory (C3)

SCSP Family

Datasheet

Product Features

■ Flash Memory Plus SRAM

— Reduces Memory Board Space

Required, Simplifying PCB Design

Complexity

■ SCSP Technology

— Smallest Memory Subsystem Footprint

— Area : 8 x 10 mm for 16 Mbit (0.13 µm)

Flash + 2 Mbit or 4 Mbit SRAM

— Area : 8 x 12 mm for 32 Mbit (0.13 µm)

Flash + 4 Mbit or 8 Mbit SRAM

— Height : 1.20 mm for 16 Mbit (0.13 µm)

Flash + 2 Mbit or 4 Mbit SRAM, and 32

Mbit (0.13um) Flash + 8 Mbit SRAM

— Height : 1.40 mm for 32 Mbit (0.13 µm)

Flash + 4 Mbit SRAM

— This Family also includes 0.25 µm, 0.18

µm, and 0.13 µm technologies

■ Advanced SRAM Technology

— 70 ns Access Time

— Low Power Operation

— Low Voltage Data Retention Mode

■ Intel® Flash Data Integrator (FDI)

Software

— Real-Time Data Storage and Code

Execution in the Same Memory Device

— Full Flash File Manager Capability

■ Advanced+ Boot Block Flash Memory

—70 ns Access Time

—Instant, Individual Block Locking

—128 bit Protection Register

—12 V Production Programming

—Fast Program and Erase Suspend

—Extended Temperature –25 °C to +85 °C

■ Blocking Architecture

—Block Sizes for Code + Data Storage

—4-Kword Parameter Blocks

—64-Kbyte Main Blocks

—100,000 Erase Cycles per Block

■ Low Power Operation

—Asynchronous Read Current: 9 mA

(Flash)

—Standby Current: 7 µA (Flash)

—Automatic Power Saving Mode

■ Flash Technologies

—0.25 µm ETOX™ VI, 0.18 µm ETOX™

VII and 0.13 µm ETOX™ VIII Flash

Technologies

The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP)

device delivers a feature-rich solution for low-power applications. The C3 SCSP memory device

incorporates flash memory and static RAM in one package with low voltage capability to

achieve the smallest system memory solution form-factor together with high-speed, low-power

operations. The C3 SCSP memory device offers a protection register and flexible block locking

to enable next generation security capability. Combined with the Intel® Flash Data Integrator

(Intel® FDI) software, the C3 SCSP memory device provides a cost-effective, flexible, code plus

data storage solution.

Order Number: 252636, Revision: 004

26 Aug 2005

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