RMPA19000 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
RMPA19000 Datasheet PDF : 8 Pages
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Vg (NEGATIVE)
2 MIL GAP
10000pF
5 MIL THICK
ALUMINA
50Ω
100pF
RF INPUT
Vd (POSITIVE)
10000pF
DIE-ATTACH
80Au/20Sn
100pF
5 MIL THICK
ALUMINA
50Ω
RF OUTPUT
100pF
10000pF
100pF
10000pF
L < 0.015"
(4 Places)
Vg (NEGATIVE)
Vd (POSITIVE)
Note:
Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief.
Vd should be biased from 1 supply as shown. Vg can be biased from either or both sides from 1 supply.
Figure 4. Recommended Assembly and Bonding Diagram
©2004 Fairchild Semiconductor Corporation
RMPA19000 Rev. C
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