RMBA19500 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
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Fabricante
RMBA19500 Datasheet PDF : 7 Pages
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Parts List for Test Evaluation Board (RMBA19500-TB, G6655917)
Part
L1, L2, L4
L3
C1
C9
C3, C4, C5
C10
C2
C8, C11, C14, C15
C6, C7
R1, R5
R2, R7
R3
R4
R6
R8
R9
U1
HS
P1
J1, J2
Board FR4
Value
5.6nH
10nH
10pF
2.2pF
1500pF
2.0pF
15.0pF
4.7µF
0.1µF
20Ω
1000Ω
910Ω
30Ω
1.1KΩ
390Ω
300Ω
RMBA19500
Heatsink
Terminals
SMA Connectors
Size (EIA)
.06" x .03"
.085" x .060"
.067" x .036"
.042" x .022"
.067" x .036"
.042" x .022"
.134" x .071"
.183" x .054"
.069" x .037"
.069" x .037"
.069" x .037"
.069" x .037"
.069" x .037"
.31" x .41"
Vendor(s)
Toko (LL1608-F5N6)
Coilcraft (0805HT-10NTKBC)
Murata (GRM39COG100J050AD)
Murata (GRM36COG2R2J050BD)
Murata (GRM39Y5V152Z50V)
Murata (GRM36COG2R20J050BD)
Murata (GRM36COG150J050)
TDK (C3216XR1A475KT)
Murata (GRM39Y5V104Z50)
IMS (RCI-0603-20R0J)
IMS (RCI-0603-1001J)
IMS (RCI-0603-9100J)
IMS (RCI-0603-30R0J)
IMS (RCI-0603-1101J)
IMS (RCI-0603-3900J)
IMS (RCI-0603-3000J)
Fairchild
Fairchild, G655548
3M (2340-5211TN)
E.F. Johnson (142-0701-841)
Fairchild Dwg# G654187/G654941
Thermal Considerations for Heat Sinking the RMBA19500
The PWB must be prepared with either an embedded
copper slug in the board where the package is to be
mounted or a heat sink should be attached to the backside
of the PWB where the package is to be mounted on the
front side. The slug or the heat sink should be made of a
highly electrically and thermally conductive material such
as copper or aluminum. The slug should be at least the
same thickness as the PWB. In the case of the heat sink, a
small pedestal should protrude through a hole in the PWB
where the package bottom is directly soldered. In either
configuration, the top surface of the slug or the pedestal
should be made coplanar with the package lead mounting
plane i.e., the top surface of the PWB. Use Sn96 solder
(96.5% Sn and 3.5% Ag) at 220°C for 20 seconds or less to
attach the heat sink to the backside of the PWB. Then,
using Sn63, the package bottom should be firmly soldered
to the slug or the pedestal while the pins are soldered to the
respective pads on the front side of the PWB without
causing any stress on the pins. Remove flux completely if
used for soldering.
©2003 Fairchild Semiconductor Corporation
RMBA19500 Rev. C
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