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NX25P10 Ver la hoja de datos (PDF) - Unspecified

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componentes Descripción
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NX25P10 Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
1M / 2M / 4M-BIT SERIAL FLASH MEMORY with 40MHz SPI
NX25P10, NX25P20 AND NX25P40
Document Revision History
Date
Rev
04/29/03
A
09/12/03
B
03/09/04
C
03/24/04
D
05/11/04
E
06/16/04
F
11/23/04
G
12/08/04
H
04/04/05
I
Description of Revision
Document Written
Incorporated spiFlash trademark for NX25P10, 20 and 40 product
family. Adjusted data for consistency
Adjusted pages 10, 11, 14, 16 and 24 for technical clarity. Updated
Special Options and Ordering Information
MLP metal die pad notification; Under "Package Types," figure 3 and
packaging information.
Corrected dimensions in Packaging Information section for 6x5mm MLP.
Updated Characterization information DC (Table 8) & AC (Table 10).
Modified dimensional data in the Packaging Information for the 6x5mm
MLP package
Added FR = 40MHz @ 3.0V to 3.6V Vcc. Added fR = 33MHz @ 3.0V
to 3.6V Vcc. Modified tLEAD in Absolute Maximum Ratings (Table 5) to
reference JEDEC Standard information. Added FR and fR conditions to
Operating Ranges (Table 6). Updated ICC3 and ICC5 data in DC Electri-
cal Characteristics (Table 8). Added 20/33MHz call outs and updated
min, max and typ data in AC Electrical Characteristics (Table 10).
Updated 8-pin 150mil SOIC package information.
Removed 8-contact 6x5 MLP package from document.
28
NexFlash Technologies, Inc.
PRELIMINARY MKP-0009 Rev 6 NXSF040I-0405
04/04/05 ©

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