MT48LC4M32B2P-7 Ver la hoja de datos (PDF) - Micron Technology

Número de pieza

componentes Descripción

Fabricante

MT48LC4M32B2P-7

1 Meg x 32 x 4 Banks SDR SDRAM

Micron Technology 

Figure 5: 90-Ball VFBGA (8mm x 13mm)

0.65 ±0.05

Seating plane

0.12 A

A

90X Ø0.45

Dimensions apply

to solder balls post

6.40

reflow. The pre-reflow

diameter is 0.42 on a

0.40 SMD ball pad.

Ball A9

11.20 ±0.10

5.60 ±0.05

0.80 TYP

Ball A1 ID

Ball A1

0.80 TYP

CL

13.00 ±0.10

6.50 ±0.05

128Mb: x32 SDRAM

Package Dimensions

Solder ball material:

62% Sn, 36% Pb, 2% Ag or

96.5% Sn, 3%Ag, 0.5% Cu

Substrate material:

Plastic laminate

Mold compound:

Epoxy novolac

Ball A1 ID

CL

3.20 ±0.05 4.00 ±0.05

8.00 ±0.10

1.00 MAX

Notes:

1. All dimensions are in millimeters.

2. Package width and length do not include mold protrusion; allowable mold protrusion is

0.25mm per side.

3. Recommended pad size for PCB is 0.33mm ±0.025mm.

PDF: 09005aef80872800

128mb_x32_sdram.pdf - Rev. U 04/13 EN

13

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2001 Micron Technology, Inc. All rights reserved.

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