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MN2WS0025

Single-Chip HDTV System LSI

Panasonic Corporation 

Panasonic Semiconductor

MN2WS0025

Single-Chip HDTV System LSI

Product Brief

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MN2WS0025 FEATURES

MN2WS0025 BENEFITS

■ Plug-and-Play/OpenCable™ and DVB ready with a on-

chip CableCARD™ interface and Common Interface.

■ Reference design available including OpenCable™ soft-

ware stacks.

■ Video input for ITU-R BT.656 format.

■ Video scaling and aspect conversion.

■ Unified Memory Architecture. Main memory is DDR333

or DDR400 SDRAM with capacity from 128 Mbits to 2

Gbits.

■ NAND flash memory interface (8- and 16-bit) that sup-

ports ECC calculation and error detection.

■ Compact BGA package, 23 mm2, with maximum power

consumption of only 2 W.

■ 32-bit RISC CPU delivers 200 MIPS and makes efficient

use of system resources by using variable-length

instructions.

■ Transport decoder can demultiplex one stream from up

to 3 sources; 48 PID filters, 40 section filters, supports

partial TS output.

■ Conditional access support: DES-ECB for Plug-and-

Play/OpenCable™, Multi2 descrambler for Japanese

satellite, and DVB common descrambler for Europe.

■ Available 2-channel audio digital input with synchroniza-

tion to video signal output.

■ Video and audio decoding for MPEG1, MPEG2

(MP@HL, MP@ML, SP@ML, MP@LL), AAC, and

Dolby® Digital (AC-3).

■ Built-in CableCARD™ interface reduces system cost.

■ Complete hardware and software design package dra-

matically reduces time-to-market.

■ Optional software modules support a variety of DTV

functions including the CableCARD™ stack for Plug-

and-Play/OpenCable™, DTV closed captioning, and

channel map database.

■ Development support and access to Panasonic Semi-

conductor’s “customer room.” Available source feeds for

ATSC, NTSC, and both Motorola and SA headends.

Also available are HPNX™ verification tools required to

test Plug-and-Play/OpenCable™ compliance and Sar-

noff bitstreams to test MPEG and PSIP compliance.

■ Reference design comes complete with:

❏ Schematics and Gerber files

❏ Bill of materials (BOM)

❏ Datasheets

❏ Software stacks

❏ Applications support

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