MCZ33990EF/R2 Ver la hoja de datos (PDF) - Freescale Semiconductor
Número de pieza
componentes Descripción
Fabricante
MCZ33990EF/R2 Datasheet PDF : 16 Pages
| |||
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating
VBAT DC Supply Voltage (1)
Input I/O Pins (2)
BUS and LOAD Outputs
ESD Voltage
Human Body Model (3)
Machine Model (4)
Symbol
VBAT
VI/O(CPU)
VBUS
VESD1
VESD2
Value
-16 to 40
-0.3 to 7.0
-2.0 to 16
±2000
±200
Unit
V
V
V
V
Storage Temperature
TSTG
-65 to 150
°C
Operating Ambient Temperature
TA
-40 to 125
°C
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow (5), (6)
TJ
TPPRT
-40 to 150
°C
Note 6.
°C
Thermal Resistance (Junction-to-Ambient)
RθJ-A
180
°C / W
Notes
1. An external series diode must be used to provide reverse battery protection of the device.
2. SLEEP, TX, RX, and 4X/LOOP are normally connected to a microcontroller.
3. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω).
4. ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω).
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33990
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
Share Link: 