MAX44280 Ver la hoja de datos (PDF) - Maxim Integrated
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MAX44280 Datasheet PDF : 16 Pages
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MAX44280
1.8V, 50MHz, Low-Offset,
Low-Power, Rail-to-Rail I/O Op Amp
ABSOLUTE MAXIMUM RATINGS
IN+, IN-, OUT..................................(VSS - 0.3V) to (VDD + 0.3V)
VDD to VSS................................................................-0.3V to +6V
SHDN........................................................................-0.3V to +6V
Output to Short-Circuit Ground Duration............................... 10s
Continuous Input Current into Any Pin............................. Q20mA
Continuous Power Dissipation (TA = +70NC)
SC70 (derate 3.1mW/NC above +70NC).......................245mW
Thin µDFN (Ultra-Thin LGA)
(derate 2.1mW/NC above +70NC)..............................110.2mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SC70
Junction-to-Ambient Thermal Resistance (BJA)..... 326.5NC/W
Junction-to-Case Thermal Resistance (BJC)..............115NC/W
Thin µDFN (Ultra-Thin LGA)
Junction-to-Ambient Thermal Resistance (BJA)........ 470NC/W
Junction-to-Case Thermal Resistance (BJC)............. 120NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, VSHDN = VDD, TA = -40NC to +125NC. Typical values are at
TA = +25NC, unless otherwise noted.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Input Voltage Range
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current
Input Capacitance
Common-Mode Rejection Ratio
Open-Loop Gain
Output Short-Circuit Current
SYMBOL
CONDITIONS
VIN+ VIN- Guaranteed by CMRR test
VOS
VOS - TC
IB
CIN
CMRR
AOL
ISC
TA = +25NC
TA = -40°C to +125°C after calibration
TA = -40°C to +125°C
TA = +25NC
TA = -40NC to +85NC
TA = -40NC to +125NC
VCM = -0.1V to (VDD + 0.1V)
0.4V P VOUT P VDD - 0.4V, ROUT = 10kI
0.4V P VOUT P VDD - 0.4V, ROUT = 600I
0.4V P VOUT P VDD - 0.4V, ROUT = 32I
To VDD or VSS
MIN TYP MAX UNITS
-0.1
VDD
+ 0.1
V
10
50
100
FV
500
0.8
5
FV/NC
0.01 0.5
10
pA
100
0.4
pF
75
90
dB
100 115
91
100
dB
80
85
mA
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