MAX3341E Ver la hoja de datos (PDF) - Maxim Integrated
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MAX3341E Datasheet PDF : 15 Pages
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±15kV ESD-Protected USB Level Translator in
UCSP with USB Detect
VL
OE
VL/2
0
tPZD
tPDZ
D+/D-
VOHD - 0.3V
VOLD + 0.3V
Figure 2. Enable and Disable Timing, Transmitter
VL
VPO
0
2V
D+/D-
0.8V
Figure 3. Mode 0 Timing
VL/2
tPHLO
VL
VPO/VMO
VL/2
0
tPLH1
tPHL1
2V
D+/D-
0.8V
Figure 4. Mode 1 Timing
occurs with handling and assembly during manufactur-
ing. All pins require this protection during manufactur-
ing. Therefore, after PC board assembly, the Machine
Model is less relevant to I/O ports.
Applications Information
External Components
External Resistors
Two external 23.7Ω ±1%, 1/2W resistors are required
for USB connection. Place the resistors in between the
MAX3341E and the USB connector on the D+ and D-
lines. See Typical Operating Circuit.
External Capacitors
Use three external capacitors for proper operation. Use
a 0.1µF ceramic for decoupling VL, a 1µF ceramic for
decoupling VCC, and a 1.0µF (min) ceramic or plastic
filter capacitor on VTRM. Return all capacitors to GND.
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. CSP reli-
ability is integrally linked to the user’s assembly meth-
ods, circuit board material, and usage environment.
The user should closely review these areas when con-
sidering use of a CSP package. Performance through
Operating Life Test and Moisture Resistance remains
uncompromised as it is primarily determined by the
wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Table 2 shows the testing done to characterize
the CSP reliability performance. In conclusion, the
UCSP is capable of performing reliably through envi-
ronmental stresses as indicated by the results in Table
2. Additional usage data and recommendations are
detailed in the UCSP application note, which can be
found on Maxim’s website at www.maxim-ic.com.
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