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MAX15048

Triple-Output Buck Controllers with Tracking/Sequencing

Maxim Integrated 

MAX15048/MAX15049

Triple-Output Buck Controllers

with Tracking/Sequencing

ABSOLUTE MAXIMUM RATINGS

IN, LX_ to SGND....................................................-0.3V to +30V

BST_ to SGND........................................................-0.3V to +30V

BST_ to LX_..............................................................-0.3V to +6V

REG, DREG_, EN_, RT to SGND..............................-0.3V to +6V

PGOOD, FB_, COMP_ to SGND..............................-0.3V to +6V

DL_ to PGND_......................................-0.3V to (VDREG_ + 0.3V)

DH_ to LX_..............................................-0.3V to (VBST_ + 0.3V)

PGND to SGND, PGND_

to Any Other PGND_..........................................-0.3V to +0.3V

Continuous Power Dissipation (TA = +70NC)

32-Pin TQFN (derate 34.5mW/NC above +70NC)....2758.6mW

Junction-to-Case Thermal Resistance (BJC)

(Note 1)......................................................................2NC/W

Junction-to-Ambient Thermal Resistance (BJA)

(Note 1)....................................................................29NC/W

Operating Junction Temperature Range............ -40NC to +85NC

Maximum Junction Temperature......................................+150NC

Storage Temperature Range............................. -60NC to +150NC

Lead Temperature (soldering, 10s)...... ………….………+300NC

Soldering (reflow).................................. ………….………+260NC

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VIN = 12V or VIN = VREG = 5V, VDREG_ = VREG, VPGND_ = 0V, CREG = 2.2FF, RRT = 39.2kI, TA = -40NC to +85NC, unless otherwise

noted. Typical values are at TA = TJ = +25NC.) (Note 2)

PARAMETER

SYSTEM SPECIFICATIONS

Input Voltage Range

Input Undervoltage-Lockout

Threshold

SYMBOL

CONDITIONS

VIN

VUVLO

VIN = VREG = VDREG_ (Note 3)

VIN rising

MIN TYP MAX UNITS

4.7

23

V

4.5

5.5

4.0

4.2

4.4

V

Input Undervoltage-Lockout

Hysteresis

0.3

V

Operating Supply Current

VIN = 12V, VFB_ = 0.8V

Shutdown Supply Current

VIN = 12V, EN_ = 0, PGOOD unconnected

VOLTAGE REGULATOR (REG)

Output-Voltage Set Point

VREG VIN = 6V to 23V

Load Regulation

IREG = 0 to 60mA, VIN = 6V

BOOTSTRAP SWITCH

Internal Boost Switch Resistance

VBST,LX = 5V

TRANSCONDUCTANCE ERROR AMPLIFIER/DIGITAL SOFT-START/-STOP

FB_ Input Bias Current

FB_ Voltage Set Point

VFB_

FB_ to COMP_ Transconductance

COMP_ Output Swing

Open-Loop Gain

Unity-Gain Bandwidth

Soft-Start/-Stop Duration

Reference Voltage Steps

6

9

mA

100 200

FA

4.75

5.25

V

0.2

V

3

I

-1

0.594

0.75

0.600

2.0

80

10

2048

64

+1

0.606

3.5

FA

V

mS

V

dB

MHz

Clocks

Steps

2  

Maxim Integrated

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