MASWGM0003-DIE Ver la hoja de datos (PDF) - Tyco Electronics
Número de pieza
componentes Descripción
Fabricante
MASWGM0003-DIE Datasheet PDF : 5 Pages
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Switch, Single-Pole, Double-Throw
2.0—8.0 GHz
Assembly and Bonding Diagram
100 pF
OUT
1
VEE A
COM
MASWGM0003-DIE
903231 —
Preliminary Information
0.1 μF
VEE
TTL
OUT
2
Figure 4. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Fol-
low the manufacturer’s instructions. If solder is employed, use AuSn (80/20) 1 mil preform solder.
Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially
above 10 GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over
ball bonds.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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