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ICS621MT

LOW SKEW 1 TO 4 CLOCK BUFFER

Integrated Device Technology 

ICS621

LOW SKEW 1 TO 4 CLOCK BUFFER

FAN OUT BUFFER

AC Electrical Characteristics

VDD = 1.2 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise

Parameter

Symbol

Conditions

Min. Typ. Max. Units

Input Frequency

0

100 MHz

Output Rise Time

Output Fall Time

Propagation Delay

tOR

tOF

Note 1

20% to 80%, Note 3

80% to 20%, Note 3

1.0 1.5 ns

1.0 1.5 ns

2.2

3

5

ns

Output to Output Skew

Note 2 Rising edges at VDD/2

0 ±150 ps

VDD = 1.5 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise

Parameter

Symbol

Conditions

Min. Typ. Max. Units

Input Frequency

0

166 MHz

Output Rise Time

Output Fall Time

Propagation Delay

tOR

tOF

Note 1

20% to 80%, Note 3

80% to 20%, Note 3

1.0 1.5 ns

1.0 1.5 ns

2.2

3

5

ns

Output to Output Skew

Note 2 Rising edges at VDD/2

0 ±150 ps

VDD = 1.8 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise

Parameter

Symbol

Conditions

Min. Typ. Max. Units

Input Frequency

0

200 MHz

Output Rise Time

Output Fall Time

Propagation Delay

tOR

tOF

Note 1

20% to 80%, Note 3

80% to 20%, Note 3

1.0 1.5 ns

1.0 1.5 ns

2.2

3

5

ns

Output to Output Skew

Note 2 Rising edges at VDD/2

0 ±150 ps

Notes: 1. With rail to rail input clock

2. Between any 2 outputs with equal loading.

3. Measured with a 15 pF load.

Thermal Characteristics

Parameter

Symbol Conditions

Thermal Resistance Junction to

Ambient

θJA Still air

θJA 1 m/s air flow

θJA 3 m/s air flow

Thermal Resistance Junction to Case θJC

Case Temperature

Thermal Resistance Junction to Top

of Case

ΨJT Still air

Min.

Typ.

150

140

120

40

20

Max. Units

°C/W

°C/W

°C/W

°C/W

120 °C

°C/W

IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER

5

ICS621

REV B 030907

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