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Número de pieza
componentes Descripción
HCTS574K Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
HCTS574K
Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered
Intersil
HCTS574K Datasheet PDF : 11 Pages
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Die Characteristics
DIE DIMENSIONS:
101 x 85 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
D0
(2)
HCTS574MS
HCTS574MS
OE
VCC
Q0
(1)
(20)
(19)
D1 (3)
D2 (4)
D3 (5)
D4 (6)
D5 (7)
D6 (8)
(18) Q1
(17) Q2
(16) Q3
(15) Q4
(14) Q5
(13) Q6
(9)
(10)
(11)
(12)
D7
GND
CP
Q7
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS574 is TA14460A.
Spec Number
518629
703
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