HCTS30D Ver la hoja de datos (PDF) - Intersil

Número de pieza

componentes Descripción

Fabricante

HCTS30D

Radiation Hardened 8-Input NAND Gate

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS30MS

HCTS30MS

A

VCC

NC

(1)

(14)

(13)

B (2)

C (3)

(12) H

(11) G

D (4)

(10) NC

E (5)

(9) NC

(6)

(7)

(8)

F

GND

Y

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS30 is TA14428A.

Spec Number 518639

448

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