28F008C3 Ver la hoja de datos (PDF) - Intel
Número de pieza
componentes Descripción
Fabricante
28F008C3 Datasheet PDF : 59 Pages
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3 VOLT ADVANCED+ BOOT BLOCK
E
1
2
3
4
5
6
7
8
16M
A
A13 A11 A8
VPP WP# A19 A7
A4
B
A14 A10 WE# RP# A18 A17 A5
A2
32M
C
A15 A12
A9
A20
A6
A3
A1
D
A16 D14
D5
D11 D2
D8 CE# A0
E VCCQ D15
D6
D12 D3
D9
D0 GND
F
GND D7 D13 D4 VCC D10 D1 OE#
NOTES:
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the
upgrade address for the 32-Mbit device.
2. 8-Mbit not available on µBGA* CSP.
Figure 3. x16 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
1
2
3
4
5
6
7
8
16M
A
A14 A12 A8
VPP WP# A20 A7
A4
B A15 A10 WE# RP# A19 A18 A5
A2
32M
C
A16 A13 A9
A21
A6
A3
A1
D A17 NC D5 NC D2 NC CE# A0
E VCCQ A11 D6
NC
D3
NC
D0 GND
F GND D7
NC
D4
VCC NC
D1 OE#
NOTES:
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A20 is the upgrade address for the 16-Mbit device. A21 is the
upgrade address for the 32-Mbit device.
2. 8-Mbit not available on µBGA* CSP.
Figure 4. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
8
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