28F008C3 Ver la hoja de datos (PDF) - Intel
Número de pieza
componentes Descripción
Fabricante
28F008C3 Datasheet PDF : 59 Pages
| |||
E
3 VOLT ADVANCED+ BOOT BLOCK
A16
1
A15
2
A14
3
A13
4
A12
5
A11
6
A9
7
A8
8
WE#
9
RP#
10
VPP
11
WP#
12
A18
13
A7
14
A6
15
A5
16
A4
17
A3
18
A2
19
A1
20
Advanced Boot
40-Lead TSOP
10 mm x 20 mm
TOP VIEW
40
A17
39
GND
38
A20 16M
37
A19
8M
36
A10
35
DQ7
34
DQ6
33
DQ5
32
DQ4
31
VCCQ
30
VCC
29
NC
28
DQ3
27
DQ2
26
DQ1
25
DQ0
24
OE#
23
GND
22
CE#
21
A0
NOTES:
1. 40-Lead TSOP available for 8- and 16-Mbit densities only.
2. Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pin 38.
Figure 1. 40-Lead TSOP Package for x8 Configurations
A15
1
A14
2
A13
3
A12
4
A11
5
A10
6
A9
7
A8
8
32M A20
9
NC
10
WE#
11
RP#
12
V PP
13
WP#
14
16M
A19
15
8M
A 18
16
A17
17
A7
18
A6
19
A5
20
A4
21
A3
22
A2
23
A1
24
Advanced Boot Block
48-Lead TSOP
12 mm x 20 mm
TOP VIEW
48
A16
47
VCCQ
46
GND
45
DQ15
44
DQ 7
43
DQ 14
42
DQ 6
41
DQ 13
40
DQ 5
39
DQ 12
38
DQ 4
37
V CC
36
DQ 11
35
DQ 3
34
DQ 10
33
DQ 2
32
DQ 9
31
DQ 1
30
DQ 8
29
DQ 0
28
OE#
27
GND
26
CE#
25
A0
NOTE:
Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pins 9 and 15.
Figure 2. 48-Lead TSOP Package for x16 Configurations
PRODUCT PREVIEW
7
Share Link: 