DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

FM204-H Ver la hoja de datos (PDF) - Shenzhen Luguang Electronic Technology Co., Ltd

Número de pieza
componentes Descripción
Fabricante
FM204-H
LUGUANG
Shenzhen Luguang Electronic Technology Co., Ltd LUGUANG
FM204-H Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Chip Silicon Rectifier
FM201 THRU FM207
Formosa MS
Reel packing
PACKAGE
SMA
SMA
REEL SIZE
7"
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
2,000
7,500
4.0
20,000 183*170*183 178
4.0
15,000 337*337*37 330
CARTON
SIZE
(m/m)
382*356*387
350*330*360
CARTON
(pcs)
160,000
120,000
APPROX.
GROSS WEIGHT
(kg)
16.0
14.2
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
TL
Tsmax
Ts m i n
tS
Preheat
Ramp-down
25
t25oC to Peak
3.Reflow soldering
Time
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25oC to Peak Temperature
Soldering Condition
<3oC/sec
150oC
200oC
60~120sec
<3oC/sec
217oC
60~260sec
255oC-0/+5oC
10~30sec
<6oC/sec
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID Issued Date
DS-121107 2008/02/10
Revised Date Revision
2010/03/09
D
Page.
7

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]