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DTC114EXV3T1 Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
DTC114EXV3T1 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
DTC114EXV3T1 Series
DEVICE MARKING AND RESISTOR VALUES
Device
Marking R1 (K) R2 (K)
Shipping
DTC114EXV3T1
8A
DTC124EXV3T1
8B
DTC144EXV3T1
8C
DTC114YXV3T1
8D
DTC114TXV3T1
94
DTC143TXV3T1
8F
10
10 3000/Tape & Reel
22
22
47
47
10
47
10
4.7
†For information on tape and reel specifications, including part orientation and
tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure,
BRD8011/D.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation,
FR−4 Board (Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 1)
Total Device Dissipation,
FR−4 Board (Note 2) @ TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 2)
Junction and Storage Temperature Range
1. FR−4 @ Minimum Pad.
2. FR−4 @ 1.0 × 1.0 Inch Pad.
Symbol
PD
RθJA
PD
RθJA
TJ, Tstg
Max
200
1.6
600
300
2.4
400
−55 to +150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
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