CRF02 Ver la hoja de datos (PDF) - Toshiba
Número de pieza
componentes Descripción
Fabricante
CRF02 Datasheet PDF : 4 Pages
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CRF02
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Repetitive peak reverse current
Reverse recovery time
Thermal resistance
Thermal resistance (junction to lead)
Symbol
VFM
IRRM(1)
IRRM(2)
trr
Rth (j-a)
Rth (j-ℓ)
Test Condition
IFM = 0.5 A
VRRM = 400 V
VRRM = 800 V
IF = 1 A, di/dt = −30 A/μs
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 1.2 mm × 1.2 mm)
(board thickness: 1.6 t)
⎯
Min Typ. Max Unit
⎯
2.2 3.0
V
⎯
⎯ 3.0 μA
⎯
⎯
50
μA
⎯
⎯ 100 ns
⎯
⎯
70
⎯
⎯ 140 °C/W
⎯
⎯ 240
⎯
⎯
20 °C/W
Marking
Abbreviation Code
F2
Part No.
CRF02
Standard Soldering Pad
1.2
1.2
2.8
Unit: mm
Handling Precaution
The absolute maximum ratings mean the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The followings are the general derating method that we recommend for designing a
circuit using this device.
VRRM: We recommend that the worst-case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of VRRM for a DC circuit; and no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient (0.1%/℃). Be sure to take this temperature coefficient into account when
designing a device at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV).
Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by
using an allowable Tamax-IF (AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180°. Therefore
this applies only to abnormal operation, which seldom occurs during the lifespan of the device.
For this device, we recommend a Tj of below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When
using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance
value.
Refer to the Rectifier databook for further information.
2
2006-11-07
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