DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

DGT409BCA6565 Ver la hoja de datos (PDF) - Dynex Semiconductor

Número de pieza
componentes Descripción
Fabricante
DGT409BCA6565
Dynex
Dynex Semiconductor Dynex
DGT409BCA6565 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
SEMICONDUCTOR
DGT409BCA
THERMAL AND MECHANICAL RATINGS
Symbol
Parameter
Rth(j-hs)
Thermal resistance – junction to
heatsink surface
Rth(c-hs) Contact thermal resistance
Tvj
Top/Tstg
Fm
Virtual junction temperature
Operating junction/storage
temperature range
Clamping force
CHARACTERISTICS
Tj =115oC unless stated otherwise
Test Conditions
Min.
Double side cooled
Single side cooled
DC
-
Anode DC
-
Cathode DC
-
Clamping force 32.0kN
With mounting compound
Per contact
-
On-state (conducting)
-
-40
11.0
Max. Units
0.046
0.073
0.124
°C/W
°C/W
°C/W
0.009 °C/W
115
°C
115
°C
15.0
kN
Symbol
Parameter
VTM)
IDM
IRRM
VGT
IGT
IRGM
EON
td
tr
EOFF
tgs
tgf
tgq
QGQ
QGQT
IGQM
On-state voltage
Peak off-state current
Peak reverse current
Gate trigger voltage
Gate trigger current
Reverse gate cathode current
Turn-on Energy
Delay time
Rise time
Turn-off energy
Storage time
Fall time
Gate controlled turn-off time
Turn-off gate charge
Total turn-off gate charge
Peak reverse gate current
Test Conditions
At 200A peak, IG(ON) = 4A d.c.
VDRM = 6500V, VRG = 0V
VRRM = 6500V
VD = 24V, IT = 100A, Tj = 25oC
VD = 24V, IT = 100A, Tj = 25oC
VRGM = 16V, No gate/cathode resistor
VD = 3000V
IT = 400A, dIT/dt = 150A/µs
IFG = 20A, rise time (tr ) < 1.5µs
IT = 800A, VDM = 3000V
Snubber Cap Cs = 2µC
diGQ/dt = 20A/us
Min. Max. Units
-
4
V
-
100
mA
-
100
mA
-
1
V
-
2
A
-
50
mA
-
2500 mJ
-
3
µs
-
7
µs
-
2500 mJ
µs
See Fig.17 and
Fig.18
µs
µs
-
3600
µC
-
7200
µC
-
350
A
3/11
www.dynexsemi.com

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]