SSD0858Z Ver la hoja de datos (PDF) - Solomon Systech
Número de pieza
componentes Descripción
Fabricante
SSD0858Z Datasheet PDF : 45 Pages
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5
DIE Arrangement
188
Pad355
DUMMY
DUMMY
DUMMY
ROW16
ROW15
:
:
:
:
ROW1
ROW0
ICONS
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
COL0
COL1
:
:
:
:
:
:
:
:
:
:
COL102
COL103
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
ROW32
ROW33
:
:
:
:
ROW48
ROW49
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
TEST19
CL
M
CL
SYNC
VOUT
VOUT
:
VOUT
VOUT
VSS
VSS
:
VSS
VSS
CVSS
CVSS
:
CVSS
CVSS
RVSS
RVSS
VCI
VCI
:
VCI
VCI
VDD
VDD
:
VDD
VDD
VL5
VL4
VL3
VL2
TEST18
TEST17
TEST16
TEST15
TEST14
TEST13
TEST12
TEST11
TEST10
TEST9
TEST8
TEST7
TEST6
TEST_IN7
VSS
MODE
VDD
TEST_IN6
VSS
MID2
VDD
MID1
VSS
MID0
VDD
TEST_IN3
TEST_IN3
TEST_IN3
RES
VSS
TEST_IN2
TEST_IN2
VDD
SA0
SDA
SDA
SDA
SCL
SCL
SCL
TEST5
TEST4
TEST3
TEST2
TEST1
SA0
SDA
SDA
VDD
TEST_IN5
TEST_IN5
TEST_IN4
TEST_IN4
VSS
TEST_IN3
TEST_IN3
TEST_IN3
RES
VDD
TEST_IN2
TEST_IN2
VSS
TEST_IN1
VSS
TEST_IN0
VDD
SYNC
M
CL
TEST0
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
Pad168
30 x VOUT
Note:
1. Diagram showing the die face up.
2. Coordinates are reference to center of the
chip.
3. Unit of coordinates and Size of all
alignment marks are in um.
4. All alignment keys do not contain gold
bump.
9 x VSS
25
25
25
15 x CVSS
25
20 x VCI
25
100
11 x VDD
25
100
25
25
25
25
100
50
100
75
18
100
100
Die size : 11.66 x 1.41 mm2
Die Thickness: 533±25µm
Bump Height: Normally 18µm
Pad1 Bump co-planarity <3µm (within die)
SSD0858
Rev 1.0
11/2002
Figure 2 – SSD0858 Pin Assignment
4
SOLOMON
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