SSD1801AV Ver la hoja de datos (PDF) - Solomon Systech

Número de pieza

componentes Descripción

Fabricante

SSD1801AV

LCD Segment / Common Driver with Controller for Character Display System

Solomon Systech  

PIN ARRANGEMENT OF SSD1801Z GOLD BUMP DIE

Alignment Keys

26.3 µm 26.3 µm 26.3 µm

26.3 µm 26.3 µm 26.3 µm

Center (-2101.9, 169.6)

X

X

Center (-2940.9, 480.0)

8.75µm

X

37.6µm

(-2835, -598.5)

X

Center (2940.9, 480.0)

61.3µm

8.75µm

X

37.6µm

(2835, -598.5)

Die Size:

Die Thickness:

Figure 2 – SSD1801Z Pin Arrangement

6170um x 1480um (include scribe line)

6070um x 1380um (exclude scribe line)

670 +/-25um

PAD: 1-63

PAD: 65-79,

PAD: 81-162

PAD: 64,80,163,179

Bump Size

52.15 x 60.2 um

164-178 74.9 x 42 um

42 x 74.9 um

52.15 X 52.15 um

Minimum Pitch

76.3um

63.7um

63.7um

Bump Height: Nominal 18um

Note:

1. The die faces up in the diagram.

2. Coordinates are reference to the center of the chip.

3. Unit of coordinates and size of all alignment keys are in um.

4. All alignment keys do not contain gold bump.

SOLOMON

Rev 1.1

01/2003

4

SSD1801 Series

Share Link: