IXDD404PI Ver la hoja de datos (PDF) - Directed Energy, Inc. An IXYS Company

Número de pieza

componentes Descripción

Fabricante

IXDD404PI

4 Amp Dual Low-Side Ultrafast MOSFET Driver

Directed Energy, Inc. An IXYS Company 

Pin Configurations

1 EN A

SO8 (SI)

8 PIN DIP (PI)

2 IN A

3 GND

4 IN B

I

EN B 8

X

D OUT A 7

D

4

VCC 6

0

4

OUT B 5

IXDD404PI/404SI/404SI-16

SO16 (SI-16)

Pin Description

SYMBOL

EN A

IN A

GND

IN B

OUT B

VCC

OUT A

EN B

FUNCTION

A Channel Enable

A Channel Input

Ground

B Channel Input

B Channel Output

Supply Voltage

A Channel Output

B Channel Enable

DESCRIPTION

The Channel A enable pin. This pin, when driven low, disables the A

Channel, forcing a high impedance state to the A Channel Output.

A Channel Input signal-TTL or CMOS compatible.

The system ground pin. Internally connected to all circuitry, this pin provides

ground reference for the entire chip. This pin should be connected to a low

noise analog ground plane for optimum performance.

B Channel Input signal-TTL or CMOS compatible.

B Channel Driver output. For application purposes, this pin is connected,

through a resistor, to Gate of a MOSFET/IGBT.

Positive power-supply voltage input. This pin provides power to the entire

chip. The range for this voltage is from 4.5V to 25V.

A Channel Driver output. For application purposes, this pin is connected,

through a resistor, to Gate of a MOSFET/IGBT.

The Channel B enable pin. This pin, when driven low, disables the B

Channel, forcing a high impedance state to the B Channel Output.

Note 1: Operating the device beyond parameters with listed “absolute maximum ratings” may cause permanent

damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not

guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.

Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when

handling and assembling this component.

Figure 2 - Characteristics Test Diagram

VIN

3

Share Link: