AFBR-5803Z Ver la hoja de datos (PDF) - Avago Technologies

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AFBR-5803Z

FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style

Avago Technologies 

Solder and Wash Process Compatibility

The transceivers are delivered with protective process

plugs inserted into the duplex SC or duplex ST connector

receptacle. This process plug protects the optical subas-

semblies during wave solder and aqueous wash process-

ing and acts as a dust cover during shipping.

These transceivers are compat­ible with either industry

standard wave or hand solder processes.

Shipping Container

The transceiver is packaged in a shipping container

designed to protect it from mechanical and ESD damage

during shipment or storage.

Board Layout - Decoupling Circuit and Ground Planes

It is important to take care in the layout of your circuit

board to achieve optimum performance from these

transceivers. Figure 7 provides a good example of a

schematic for a power supply decoupling circuit that

works well with these parts. It is further recommended

that a contiguous ground plane be provided in the

circuit board directly under the transceiver to provide

a low inductance ground for signal return current. This

recommen­da­tion is in keeping with good high frequency

board layout practices.

Board Layout - Hole Pattern

The Avago Technologies trans­ceiver complies with the

circuit board “Common Transceiver Footprint” hole

pattern defined in the original multisource announce­

ment which defined the 1 x 9 package style. This drawing

is repro­duced in Figure 8 with the addition of ANSI

Y14.5M compliant dimensioning to be used as a guide in

the mechani­cal layout of your circuit board.

Board Layout - Mechanical

For applications providing a choice of either a duplex SC

or a duplex ST connector interface, while utilizing the

same pinout on the printed circuit board, the ST port

needs to protrude from the chassis panel a minimum

of 9.53 mm for sufficient clearance to install the ST

connector.

Please refer to Figure 8a for a mechanical layout detailing

the recommended location of the duplex SC and duplex

ST trans­ceiver packages in relation to the chassis panel.

20.32

(0.800)

2 x Ø 1.9 ± 0.1

(0.075 ± 0.004)

20.32

(0.800)

9 x Ø 0.8 ± 0.1

(0.032 ± 0.004)

2.54

(0.100)

TOP VIEW

DIMENSIONS ARE IN MILLIMETERS (INCHES)

Figure 8. Recommended Board Layout Hole Pattern



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