141S/143S Series
Numeric Display/Case Size 9.6 x 13.0 mm
TTW (Through The Wave) soldering Conditions
Pre-heating
100 ℃
60 s
(MAX.) Resin surface temperature
(MAX.)
Solder Bath Temp.
Dipping Time
265 ℃
5s
(MAX.)
(MAX.)
Position
At least 2.0 mm away from the root of lead
1) The dip soldering process shall be 2 times maximum.
2) The product shall be cooled to normal temperature before the second dipping process.
Manual Soldering Conditions
Iron tip temp.
Soldering time and frequency
Position
400 ℃ (MAX.) (30 W Max.)
3 s (MAX.)
2 times (MAX.)
At least 2.0 mm away from the root of lead
2007.8.31
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