MAX785 Ver la hoja de datos (PDF) - Maxim Integrated
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MAX785 Datasheet PDF : 24 Pages
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Product Reliability Report
NPN
LATERAL PNP
VERTICAL PNP
N+ EMITTER = 2.5µm
Al/Si (1%) = 11kÅ
,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, SiO2/Si3N4=0.8µm
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,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
P+ ISO
,,,,P,+ ,,,,,,N,+,,,,,,,,,,,,N,+,,,,,,,
P+ ISO
,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,P,+,,,,,,,,,P,+,,,,,,,,,P,+,,,,,,,,,,N,+,,,,,,,,P,+,,I,SO,,,,,,,,,,,,P,+,,,,,,,,,,N,+,,,,,,, P+ ISO
N EPI = 17µm
N+ BURIED LAYER = 4.5µm
N+ BURIED LAYER = 4.5µm
P BASE = 3µm
P+ ISOLATION = 20µm
P SUBSTRATE <111>
Figure 7. Bipolar Process
manufacturing steps must be subjected to Maxim’s
reliability testing before release to manufacturing for
mass production. Our reliability program includes
the following steps:
Step 1: Initial Reliability Qualification Program
Step 2: Ongoing Reliability Monitor Program
Step 3: In-Depth Failure Analysis and
Corrective Action
Tables 5–11 show the results of long-term Life Tests
by process and device type. Tables 12–16 show
the results of the 85/85, Pressure Pot, HAST,
Temperature Cycling, and High-Temperature
Storage Life tests, by device type. Tables 17 and
18 show hybrid product reliability.
Step 1: Initial Reliability Qualification Program
Maxim’s product reliability test program meets EIA-
JEDEC standards and most standard OEM reliabili-
ty test requirements.
Table 1 summarizes the qualification tests that are
part of Maxim’s reliability program. Before releasing
products, we require that three consecutive manu-
facturing lots from a new process technology suc-
cessfully meet the reliability test requirements.
Step 2: Ongoing Reliability Monitor Program
Each week Maxim identifies three wafer lots per
process per fab to be the subjects of reliability moni-
tor testing. Each lot is Pressure Pot tested, and tested
to 192 hours of High-Temperature Life (at 135°C). On
a quarterly basis, one wafer lot per process per fab is
identified and subjected to the same long-term relia-
bility tests as defined in Table 1. Test results are fed
back into production.
Step 3: In-Depth Failure Analysis
and Corrective Action
Our technical failure-analysis staff is capable of ana-
lyzing every reliability test failure to the device level. If
an alarming reliability failure mechanism or trend is
identified, the corrective action is initiated automati-
cally. This proactive response and feedback ensures
that discrepancies in any device failure mechanism
are corrected before becoming major problems.
Designed-In High Reliability
A disciplined design methodology is an essential
ingredient of manufacturing a reliable part. No
amount of finished-product testing can create relia-
bility in a marginal design.
To design-in reliability, Maxim began by formulating a
set of physical layout rules that yield reliable products
even under worst-case manufacturing tolerances.
These rules are rigorously enforced, and every circuit
is subjected to computerized Design Rule Checks
(DRCs) to ensure compliance.
Special attention is paid to Electrostatic Discharge
(ESD) protection. Maxim’s goal is to design every
pin of every product to withstand ESD voltages in
excess of 2000V, through a unique protection struc-
ture. In the case of our RS-232 interface circuits,
products can even withstand ±15kV ESD using the
human-body model, ±8kV ESD using IEC1000-4-2
contact discharge, or ±15kV ESD using IEC1000-4-2
air-gap discharge. Maxim tests each new product
for designed 50mA latchup protection.
Designs are extensively simulated (using both
circuit and logic simulation software) to evaluate
performance under worst-case conditions.
Finally, every design is checked and rechecked
by independent teams before being released to
mask making.
Wafer Inspection
All wafers are fabricated using stable, proven
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