FOD815W Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FOD815W Datasheet PDF : 9 Pages
| |||
Package Dimensions
(Through Hole)
0.200 (5.10)
0.161 (4.10)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.157 (4.00)
0.118 (3.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.020 (0.51)
TYP
0.024 (0.60)
0.016 (0.40)
0.300 (7.62)
typ
0.010 (0.26)
Package Dimensions
(Surface Mount)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.051 (1.30)
0.043 (1.10)
0.024 (0.60)
0.004 (0.10)
0.110 (2.79)
0.090 (2.29)
Lead Coplanarity 0.004 (0.10) MAX
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.049 (1.25)
0.030 (0.76)
0.412 (10.46)
0.388 (9.86)
Package Dimensions
(0.4" Lead Spacing)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
0.110 (2.80)
0.011 (1.80)
0.42 (10.66)
0.38 (9.66)
Note:
All dimensions are in inches (millimeters)
0.291 (7.40)
0.252 (6.40)
0.010 (0.26)
Footprint Dimensions
(Surface Mount))
1.5
1.3
9
2.54
0.010 (0.26)
5
FOD815 Series Rev. 1.0.4
www.fairchildsemi.com
Share Link: 