BGF125 Ver la hoja de datos (PDF) - Infineon Technologies

Número de pieza

componentes Descripción

Fabricante

BGF125

SIM Card Interface Filter and ESD Protection

Infineon Technologies 

Footprint

BGF125

SIM Card Interface Filter and ESD Protection

BGF125

0.8

0.4

Figure 5

0.25

WLP-8-10-N-FP V02

Recommended PCB pad design for reflow soldering

Tape

4

0.25

1.33

Pin 1

Corner Index Area

0.75

WLP-8-10-N-TP V01

Figure 6 Tape for BGF125 / WLP-8-10

You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”:

http://www.infineon.com/products.

Data Sheet

7

V2.0, 2009-04-01

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