BGF125 Ver la hoja de datos (PDF) - Infineon Technologies
Número de pieza
componentes Descripción
Fabricante
BGF125 Datasheet PDF : 7 Pages
| |||
BGF125
BGF125
SIM Card Interface Filter and ESD Protection
BGF125
Features
• ESD protection circuit and interface filter for SIM cards
• Reduced line capacitance of 12 pF maximum
• ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on
external IOs
• Wafer level package with SnAgCu solder balls
• 400 µm solder ball pitch
• RoHS and WEEE compliant package
WLP-8-10-N-3D
Description
BGF125 is an ESD protection and filtering circuit for SIM card interfaces. All external IOs are protected against
ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green lead-free
and halogen-free package with a size of only 1.15 mm x 1.15 mm and a total height of 0.6 mm
C2 Ext. IOs
A3
R1, 100Ω
A2
B3
R2, 47Ω
B1
C3
R3, 100Ω
C1
Figure 1 Schematic
GND, B2
BGF125 _schematic.vsd
Type
BGF125
Package
WLP-8-10
Marking
25
Chip
N0745
Table 1 Maximum Ratings
Parameter
Symbol
Voltage at all pins to GND
VP
Operating temperature range
TOP
Storage temperature range
TSTG
Summed up input power for all pins
Pin
Electrostatic Discharge According to IEC61000-4-2
Contact discharge at internal pins A3, B3, C3 VESD
Contact discharge at external pins A2, B1, C1, VESD
C2
Min.
0
-40
-65
–
-2
-15
Values
Unit
Typ. Max.
–
5
V
–
+85 °C
–
+150 °C
–
60 mW
–
2
kV
–
15 kV
Note /
Test Condition
–
–
–
TS < 70 °C
–
–
Data Sheet
4
V2.0, 2009-04-01
Share Link: 