SPT9691 Ver la hoja de datos (PDF) - Signal Processing Technologies
Número de pieza
componentes Descripción
Fabricante
SPT9691 Datasheet PDF : 10 Pages
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PIN ASSIGNMENTS
QA 1
QA 2
GNDA 3
LEA 4
LEA 5
DVEE(A) 6
AVEE(A) 7
AVCC(A) 8
-INA 9
+INA 10
DIP/PDIP
20 QB
19 QB
18 GNDB
17 LE
B
16 LE B
15 DV EE(B)
14 AV EE(B)
13 AVCC (B)
12 -INB
11 +IN B
QA QA QB QB GNDB
3 2 1 20 19
GNDA 4
18 LEB
LEA 5
LEA 6
DVEE(A) 7
TOP VIEW
LCC/PLCC
17 LEB
16 DVEE(B)
15 AVEE(B)
AVEE(A) 8
14 AVCC(B)
9 10 11 12 13
AVCC(A) -INA +INA +INB -INB
PIN FUNCTIONS
NAME
FUNCTION
QA
Output A
QA
Inverted Output A
GNDA
Ground A
LE A
Inverted Latch Enable A
LEA
AVCC(A)
AVEE(A)
DVEE(A)
AVCC(B)
AVEE(B)
DVEE(B)
-INA
+INA
+INB
-INB
Latch Enable A
Positive Supply Voltage (+10 V)
Negative Supply Voltage (-10 V)
Negative Supply Voltage (-5.2 V)
Positive Supply Voltage (+10 V)
Negative Supply Voltage (-10 V)
Negative Supply Voltage (-5.2 V)
Inverting Input A
Noninverting Input A
Noninverting Input B
Inverting Input B
LE B
Inverted Latch Enabled B
LEB
GNDB
QB
Latch Enable B
Ground B
Inverted Output B
QB
Output B
ORDERING INFORMATION
PART NUMBER
TEMPERATURE RANGE
PACKAGE TYPE
SPT9691SCC
SPT9691SCN
SPT9691SCP
SPT9691SCU
0 to +70 °C
0 to +70 °C
0 to +70 °C
+25 °C
20C LCC
20L Plastic DIP
20L Plastic Leaded Chip Carrier (PLCC)
Die*
*Please see the die specification for guaranteed electrical performance.
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly
granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific
written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably
expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device
failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
SPT
10
SPT9691
10/6/97
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