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SG3527A Ver la hoja de datos (PDF) - Microsemi Corporation

Número de pieza
componentes Descripción
Fabricante
SG3527A
Microsemi
Microsemi Corporation Microsemi
SG3527A Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Regulating Pulse Width Modulator
Connection Diagrams and Ordering Information
Ambient
Temperature
-55°C to
125°C
-25°C to 85°C
-0°C to 70°C
-25°C to 85°C
-0°C to 70°C
-25°C to 85°C
-0°C to 70°C
Type Package
J
16-PIN
ceramic DIP
N
16-PIN
plastic DIP
16-pin wide
DW
body
plastic
SOIC
Part Number
SG1525AJ-883B
SG1525AJ-JAN
SG1525AJ-DESC
SG1525AJ
SG1527AJ-883B
SG1527AJ-JAN
SG1527AJ-DESC
SG1527AJ
SG2525AJ
SG2527AJ
SG3525AJ
SG3527AJ
SG2525AN
SG2527AN
SG3525AN
SG3527AN
SG2525ADW
SG2527ADW
SG3525ADW
SG3527ADW
Packaging
Type
CERDIP
PDIP
SOIC
Connection Diagram
INV. Input 1
N.I. Input 2
SYNC 3
OSC. Output 4
CT 5
RT 6
Discharge 7
Soft-start 8
16 VREF
15 +VIN
14 Output B
13 VC
12 Ground
11 Output A
10 Shutdown
9 Compensation
N Package: RoHS Compliant / Pb-free
Transition DC: 0503
N Package: RoHS / Pb-free 100%
Matte Tin Lead Finish
INV. Input
1
N.I. Input
2
SYNC
3
OSC. Output 4
CT
5
RT
6
Discharge
7
Soft-start
8
16
VREF
15
+VIN
14 Output B
13
VC
12 Ground
11 Output A
10 Shutdown
9 Compensation
DW Package: RoHS Compliant / Pb-
free Transition DC: 0516
DW Package: RoHS / Pb-free 100%
Matte Tin Lead Finish
-55°C to
125°C
SG1525AL-883B
20-pin
ceramic
SG1525AL
L
leadless SG1527AL-883B
chip carrier
(LCC)
SG1527AL
CLCC
1. N.C.
2. INV. Input
3. N.I. Input
4
4. SYNC
5
5. OSC. Output
6. N.C.
6
7. C T
7
8. R T
8
9. Discharge
10. Soft-start
3 2 1 20 19
9 10 11 12 13
11. N.C.
12. Comp
18 13. Shutdown
17 14. Output A
15. Ground
16 16. N.C.
15 17. VC
14 18. Output B
19. +VIN
20. VREF
Notes:
1. Contact factory for JAN and DESC product availability.
2. All packages are viewed from the top.
3. Hermetic Packages J & L use Sn63Pb37 hot solder dip lead finish, contact factory for availability of RoHS compliant
versions.
2

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