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5962-9559701MPA Datasheet PDF : 23 Pages
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AD8036/AD8037
ABSOLUTE MAXIMUM RATINGS1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Voltage Swing × Bandwidth Product . . . . . . . . . . . 350 V-MHz
|VH–VIN| . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 6.3 V
|VL–VIN| . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 6.3 V
Internal Power Dissipation2
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . 1.3 Watts
Small Outline Package (SO) . . . . . . . . . . . . . . . . . . 0.9 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 1.2 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range N, R . . . . . . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air:
8-Lead Plastic DIP: θJA = 90°C/W
8-Lead SOIC: θJA = 155°C/W
8-Lead Cerdip: θJA = 110°C/W.
METALIZATION PHOTO
Dimensions shown in inches and (mm).
Connect Substrate to –VS.
–IN
VH
+VS
2
8
7
0.046
(1.17)
6
OUT
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by these
devices is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Exceeding this limit temporarily
may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package. Exceeding
a junction temperature of 175°C for an extended period can
result in device failure.
While the AD8036 and AD8037 are internally short circuit pro-
tected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (150°C) is not exceeded under all
conditions. To ensure proper operation, it is necessary to observe
the maximum power derating curves.
2.0
8-LEAD PLASTIC DIP
PACKAGE
TJ = +150؇C
1.5
1.0
8-LEAD SOIC
0.5
PACKAGE
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – ؇C
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature
ORDERING GUIDE
3
4
5
+IN
–VS
VL
0.050 (1.27)
–IN
VH
2
8
8036
AD8036
+VS
7
0.046
(1.17)
6
OUT
3
4
5 8037
Model
Temperature
Range
Package
Description
Package
Option
AD8036AN
–40°C to +85°C Plastic DIP
AD8036AR
–40°C to +85°C SOIC
AD8036AR-REEL –40°C to +85°C 13" Tape and Reel
AD8036AR-REEL7 –40°C to +85°C 7" Tape and Reel
AD8036ACHIPS –40°C to +85°C Die
AD8036-EB
Evaluation Board
5962-9559701MPA –55°C to +125°C Cerdip
AD8037AN
–40°C to +85°C
AD8037AR
–40°C to +85°C
AD8037AR-REEL –40°C to +85°C
AD8037AR-REEL7 –40°C to +85°C
AD8037ACHIPS –40°C to +85°C
AD8037-EB
Plastic DIP
SOIC
13" Tape and Reel
7" Tape and Reel
Die
Evaluation Board
N-8
SO-8
SO-8
SO-8
Q-8
N-8
SO-8
SO-8
SO-8
+IN
–VS
VL
0.050 (1.27)
AD8037
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8036/AD8037 features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. B
–3–
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