SPI-335-34 Ver la hoja de datos (PDF) - SANYO -> Panasonic
Número de pieza
componentes Descripción
Fabricante
SPI-335-34 Datasheet PDF : 6 Pages
| |||
SPI-335-34
Package dimensions and Pin connection
As stated in the sttached paper. (No.6029 5/6)
Rank marking of collector output
The bottom of the package is colored following the table of classification of collector output.
Lot marking
Color division shall be done as shown in the drawing. (Fig. 2)
Year of even number : Front side
Year of odd number : Back side
A
Front side
B
Fig. 2
Color
Part ‘A’
Part ‘B’
Black
January
July
Blue
February
August
Red
March
September
Green
April
October
Orange
May
November
Brown
June
December
Soldering conditions
(1) Temperature
(2) Time
(3) Clearance
: Max. 260°C
: Max. 3sec
: Min. 1mm from the case edge. (Fig. 3)
Fig. 3
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend at intervals of 2mm from the case edge.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
No.6029 2/6
Share Link: 