HFA3127 Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
HFA3127 Datasheet PDF : 13 Pages
| |||
HFA3046, HFA3096, HFA3127, HFA3128
Die Characteristics
DIE DIMENSIONS:
53 mils x 52 mils x 19 mils
1340µm x 1320µm x 483µm
METALLIZATION:
Type: Metal 1: AlCu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AlCu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layout
PASSIVATION:
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
PROCESS:
UHF-1
SUBSTRATE POTENTIAL: (POWERED UP)
Unbiased
HFA3096, HFA3127, HFA3128
1340µm
(53 mils)
2 1 16 15
3
14
4
13
5
12
6
11
7 8 9 10
1320µm
(52 mils)
HFA3046
1340µm
(53 mils)
2 1 14 13
3
12
4
5
11
6
10
78
9
1320µm
(52 mils)
Pad numbers correspond to SOIC pinout.
10
FN3076.13
December 21, 2005
Share Link: 