LX7001CDM(2005) Ver la hoja de datos (PDF) - Microsemi Corporation

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LX7001CDM
(Rev.:2005)

TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT

Microsemi Corporation 

LX7001

PRODUCT DATABOOK 1996/1997

TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT

PRODUCTION DATA SHEET

A B S O L U T E M A X I M U M R A T I N G S (Note 1)

Input Supply Voltage (V ) ............................................................................... -1V to 12V

IN

RESET Output Voltage (VOUT) .......................................................................... -1V to 12V

Output Sink Current (I ) ............................................................ Internally Limited (mA)

OL

Clamp Diode Forward Current (IF), Pin 1 to pin 2 ............................................... 100mA

Operating Junction Temperature

Ceramic (Y - Package) .......................................................................................... 150°C

Plastic (DM, LP - Packages) .................................................................................. 150°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C

Peak Package Solder Reflow Temp. (40 second max. exposure)...................................260°C(+0, -5)

Note 1. Values beyond which damage may occur. All voltages are specified with respect to

ground, and all currents are positive into the specified terminal.

T H E R M A L D ATA

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT, . JA

LP PACKAGE:

165°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT, . JA

Y PACKAGE:

156°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT, . JA

130°C/W

Junction Temperature Calculation:

T

J

=

T

A

+

(P

D

x

.

).

JA

The . JA numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow

PA C K A G E P I N O U T S

RESET 1

VIN

2

N.C. 3

GROUND 4

8 N.C.

7 N.C.

6 N.C.

5 N.C.

Y PACKAGE

(Top View)

RESET

VIN

N.C.

GROUND

18

27

36

45

N.C.

N.C.

N.C.

N.C.

DM PACKAGE

(Top View)

RoHS / Pb-free 100% Matte Tin Lead Finish

3. GROUND

2. VIN

1. RESET

LP PACKAGE

(Top View)

RoHS / Pb-free 100% Matte Tin Lead Finish

2

Copyright © 1999

Rev. 1.2a 10/04

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