HSMA-T725 Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza

componentes Descripción

Fabricante

HSMA-T725

Surface Mount High Performance AlInGaP LED Indicators

HP => Agilent Technologies 

Recommended Printed Circuit Board Attachment Pad Geometries

INFRARED/VAPOR PHASE

REFLOW SOLDERING

4.45

(0.175)

COMPONENT LOCATION

ON PAD

2.41

(0.095)

1.65

(0.065)

CONDUCTIVE ATTACHMENT

4.45

(0.175)

2.41

(0.095)

1.65

(0.065)

0.64 (0.025) SQ.

CENTERED HOLE

COMPONENT LOCATION

ON PAD

NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

Convective IR Reflow

Soldering

For information on convective IR

reflow soldering, refer to the

Supplement to Application Note

1060, Surface Mounting SMT

LED Components.

1-203

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